Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)

Draft standard [WITHDRAWN]

DIN EN 61189-5-2:2013-04 - Draft

Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)

German title
Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5-2: Prüfverfahren für bestückte Leiterplatten: Teil Lötflussmittel (IEC 91/1070/CD:2012)
Date of issue
2013-04-02
Publication date
2013-04
Original language
German, English
Pages
83

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Date of issue
2013-04-02
Publication date
2013-04
Original language
German, English
Pages
83
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Replacement amendments

This document has been replaced by: DIN EN 61189-5-2:2015-11 .

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