Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis (IEC 63378-3:2025); German version EN IEC 63378-3:2025

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DIN EN IEC 63378-3:2026-08 - Draft

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis (IEC 63378-3:2025); German version EN IEC 63378-3:2025

German title
Thermische Standardisierung von Halbleitergehäusen - Teil 3: Thermische Schaltungssimulationsmodelle von diskreten Halbleitergehäusen für die Transientenanalyse (IEC 63378-3:2025); Deutsche Fassung EN IEC 63378-3:2025
Date of issue
2026-07-03
Publication date
2026-08
Original language
German
Pages
15

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Date of issue
2026-07-03
Publication date
2026-08
Original language
German
Pages
15
DOI
https://dx.doi.org/10.31030/3704884
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ICS

31.080.01

DOI

https://dx.doi.org/10.31030/3704884

Cooperation at DIN

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