Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2565/FDIS) (english version)

Draft standard

OVE EN IEC 60749-20-1:2023-11-01 - Draft

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2565/FDIS) (english version)

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind (IEC 47/2565/FDIS) (englische Fassung)
Publication date
2023-11-01
Original language
English
Pages
6

from 15.35 EUR VAT included

from 14.35 EUR VAT excluded

Format and language options

PDF download

  • 15.35 EUR

Shipment (3-5 working days)

  • 17.26 EUR

Monitor with the Standards Ticker

This option is only available after login.
Easily subscribe: Save time and money now!

You can also subscribe to this document - together with other important standards in your industry. This makes your work easier and pays for itself after a short time.

Sparschwein_data
Subscription advantages
Sparschwein Vorteil 1_data

Important standards for your industry, regularly updated

Sparschwein Vorteil 2_data

Much cheaper than buying individually

Sparschwein Vorteil 3_data

Useful functions: Filters, version comparison and more

Publication date
2023-11-01
Original language
English
Pages
6
Loading recommended items...

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Loading recommended items...