Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications (IEC 91/2052/CDV) (english version)

Draft standard

OVE EN IEC 61249-2-54:2025-10-15 - Draft

Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications (IEC 91/2052/CDV) (english version)

Publication date: 2025-10-15
Original language: English
Pages: 26

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Publication date: 2025-10-15
Original language: English
Pages: 26

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