Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

Standard [CURRENT]

BS EN IEC 61189-2-807:2021-11-05

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen Prüfverfahren für Materialien für Verbindungsstrukturen. Zersetzungstemperatur (Td) unter der Nutzung von TGA
Publication date
2021-11-05
Original language
English
Pages
14

from 172.20 EUR VAT included

from 160.93 EUR VAT excluded

Format and language options

PDF download

  • 172.20 EUR

Shipment (3-5 working days)

  • 191.50 EUR

Monitor with the Standards Ticker

This option is only available after login.
Easily subscribe: Save time and money now!

You can also subscribe to this document - together with other important standards in your industry. This makes your work easier and pays for itself after a short time.

Sparschwein_data
Subscription advantages
Sparschwein Vorteil 1_data

Important standards for your industry, regularly updated

Sparschwein Vorteil 2_data

Much cheaper than buying individually

Sparschwein Vorteil 3_data

Useful functions: Filters, version comparison and more

Publication date
2021-11-05
Original language
English
Pages
14

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...