We use cookies to make our websites more user-friendly and to continuously improve them. If you continue to use the website, you consent to the use of cookies. You can find more information in our privacy statement and our cookie guidelines.

To our valued customers,

At last: 

Beuth Verlag is now DIN Media. 

You can find out more about our new name and the reasons behind it here.

To use our new website without any hiccups, please clear your browser cache. 

Yours sincerely,

DIN Media

Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [WITHDRAWN]

DIN EN 60191-6-12:2003-01

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type (IEC 60191-6-12:2002); German version EN 60191-6-12:2002

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-12: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Feinraster-Land-Grid-Array (FLGA); Rechteckige Ausführung (IEC 60191-6-12:2002); Deutsche Fassung EN 60191-6-12:2002
Publication date
2003-01
Original language
German
Pages
22

Please select

from 106.30 EUR VAT included

from 99.35 EUR VAT excluded

Purchasing options

PDF download 1

  • 106.30 EUR

Shipment (3-5 working days) 1

  • 128.50 EUR

1

 Attention: Document withdrawn!

Publication date
2003-01
Original language
German
Pages
22

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Replacement amendments

This document has been replaced by: DIN EN 60191-6-12:2011-12 .

Cooperation at DIN

Relationship to other standards
This document references:
This document is referenced in:
Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...