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Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010

Standard [CURRENT]

DIN EN 60191-6-20:2011-03

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-20: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen mit J-förmigen Anschlüssen (SOJ) (IEC 60191-6-20:2010); Deutsche Fassung EN 60191-6-20:2010
Publication date
2011-03
Original language
German
Pages
14

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Publication date
2011-03
Original language
German
Pages
14
DOI
https://dx.doi.org/10.31030/1738044
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Overview

The DIN EN 60191-6 standard series is based on the corresponding IEC 60191-6 series of International standards. It defines rules for outline drawings of surface mounted semiconductor device packages of varying package and terminal designs which are used during computer supported design and manufacturing processes. This part of DIN EN 60191 (contains or) specifies measuring methods for package dimensions of small outline J-lead packages (SOJ) which correspond to outline style E according to IEC 60191-4. The responsible Committee is Subcommittee UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

ICS

01.100.25, 31.240

DOI

https://dx.doi.org/10.31030/1738044

Cooperation at DIN

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