DIN EN 61190-1-1:2003-01

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002

German title: Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage (IEC 61190-1-1:2002); Deutsche Fassung EN 61190-1-1:2002)
Publication date: 2003-01
Original language: German
Pages: 22
Note: The publisher recommends this document in lieu of the withdrawn document DIN 32513-1:2005-01 , for which no replacement is available.

Publication date: 2003-01
Original language: German
Pages: 22
Note: The publisher recommends this document in lieu of the withdrawn document DIN 32513-1:2005-01 , for which no replacement is available.
DOI: https://dx.doi.org/10.31030/9430380

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ICS

25.160.50, 31.190

DOI

https://dx.doi.org/10.31030/9430380

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