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Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method (IEC 61967-4:2002 + A1:2006); German version EN 61967-4:2002 + A1:2006, Corrigendum to DIN EN 61967-4:2006-07, (IEC 61967-4:2002/COR1:2017); German version EN 61967-4:2002/AC:2017-07

Standard [WITHDRAWN]

DIN EN 61967-4 Berichtigung 2:2017-10

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method (IEC 61967-4:2002 + A1:2006); German version EN 61967-4:2002 + A1:2006, Corrigendum to DIN EN 61967-4:2006-07, (IEC 61967-4:2002/COR1:2017); German version EN 61967-4:2002/AC:2017-07

German title
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz - Teil 4: Messung der leitungsgeführten Aussendungen - Messung mit direkter 1 Ohm/150 Ohm-Kopplung (IEC 61967-4:2002 + A1:2006); Deutsche Fassung EN 61967-4:2002 + A1:2006, Berichtigung zu DIN EN 61967-4:2006-07, (IEC 61967-4:2002/COR1:2017); Deutsche Fassung EN 61967-4:2002/AC:2017-07
Publication date
2017-10
Original language
German
Pages
4

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Publication date
2017-10
Original language
German
Pages
4
DOI
https://dx.doi.org/10.31030/2754842
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Overview

High-frequency emissions from integrated circuits can influence the increasingly sensitive electronic components and systems, causing malfunctions or failures. To avoid these hazards to the electronic controls of devices, systems and equipment, it is necessary to define standardized tests to measure and evaluate the electromagnetic interference of integrated circuits. This part of IEC 61967 specifies a method to measure the conducted electromagentic emission (EME) of integrated circuits by direct radion frequency (RF) current measurement with a 1 ohm resitive probe and RF voltage measurement using a 150 ohm coupling network. These methods guarantee a high degree of repeatability and correlation of EME measurements. The present Corrigendum corrects the general measurement assembly specified in Figure 5 with regard to one of the values specified therein. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

ICS

31.200

DOI

https://dx.doi.org/10.31030/2754842
Replacement amendments

This document has been replaced by: DIN EN IEC 61967-4:2023-08; VDE 0847-21-4:2023-08 .

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