DIN EN 62433-3:2017-10

The complexity and diversity of integrated circuits (IC) in terms of integration density and functionality increases with each development step at a reduced form factor. ICs have become faster than ever at lower supply voltages. Modern ICs can combine RF modules with analog and/or digital logic cores on a single chip. The packing density of printed circuit boards with such ICs has also increased. The emissions from an IC can be coupled back into neighboring components and cause undesired system behavior or even system failure. Thus, the emissions of ICs are becoming more and more important. As a result of this increased risk of emissions radiated by ICs, the use of simulation tools for evaluating the emission behavior of each module in the IC design phase is essential. This document describes models for simulating the emission behavior at the IC level. The proposed IC macromodel is inserted in 3D electromagnetic simulation tools to predict and simulate the IC's near-field emissions at any point in space, and to simulate and assess the effect of radiated emissions on neighboring ICs, cables, transmission lines, and so on. For ICs with multiple modes of operation, functionalities and programmable logic, the emission profile is completely different depending on the operating modes and conditions of the IC. Consequently, these models apply to the conditions under which they were derived. They are used to predict the radiated electromagnetic emissions at the application level. The first part of the document contains the electrical description of the elements of the ICEM-RE, the second part describes a universal data exchange format, which is referred to as REML and is based on XML. This format allows encoding the ICEM-RE in a more useable and generic form for emission simulation. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.