Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023

Standard [CURRENT]

DIN EN IEC 61189-2-801:2024-08

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-801: Prüfung der thermischen Leitfähigkeit für Grundwerkstoffe (IEC 61189-2-801:2023); Deutsche Fassung EN IEC 61189-2-801:2023
Publication date
2024-08
Original language
German
Pages
12

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Publication date
2024-08
Original language
German
Pages
12
DOI
https://dx.doi.org/10.31030/3543605
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Overview

This part of IEC 61189 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate. There are no restrictions on the scope of application of the document. Its application increases investment security for manufacturers and users, provides testing laboratories and manufacturers with defined information for testing, and increases product compatibility between manufacturers.

ICS

31.180

DOI

https://dx.doi.org/10.31030/3543605

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