Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023

Standard [CURRENT]

DIN EN IEC 61189-2-803:2024-08

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten (IEC 61189-2-803:2023); Deutsche Fassung EN IEC 61189-2-803:2023
Publication date
2024-08
Original language
German
Pages
10

from 67.70 EUR VAT included

from 63.27 EUR VAT excluded

Format and language options

PDF download

  • 67.70 EUR

Shipment (3-5 working days)

  • 86.50 EUR

Monitor with the Standards Ticker

This option is only available after login.
Easily subscribe: Save time and money now!

You can also subscribe to this document - together with other important standards in your industry. This makes your work easier and pays for itself after a short time.

Sparschwein_data
Subscription advantages
Sparschwein Vorteil 1_data

Important standards for your industry, regularly updated

Sparschwein Vorteil 2_data

Much cheaper than buying individually

Sparschwein Vorteil 3_data

Useful functions: Filters, version comparison and more

Publication date
2024-08
Original language
German
Pages
10
DOI
https://dx.doi.org/10.31030/3543608
Loading recommended items...

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Overview

This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA). There are no restrictions on the scope of application of the document. Its application increases investment security for manufacturers and users, provides testing laboratories and manufacturers with defined information for testing, and increases product compatibility between manufacturers.

ICS

31.180

DOI

https://dx.doi.org/10.31030/3543608

Cooperation at DIN

Relationship to other standards
This document references:
Loading recommended items...