DIN EN IEC 63215-2:2025-03

This part of IEC 63215 applies to the die attach materials and joining system applied to discrete type power electronic devices. This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index). The test method specified in this document is not intended to evaluate power semiconductor devices themselves. The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages. Through its application, the document increases investment security for manufacturers and users, provides testing laboratories and manufacturers with defined information for testing.