Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (IEC 63251:2023); German version EN IEC 63251:2023

Standard [CURRENT]

DIN EN IEC 63251:2024-07

VDE 0885-201:2024-07

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (IEC 63251:2023); German version EN IEC 63251:2023

German title
Prüfverfahren für mechanische Eigenschaften von elektrisch-optischen Leiterplatten unter Wärmebeanspruchung (IEC 63251:2023); Deutsche Fassung EN IEC 63251:2023
Publication date
2024-07
Original language
German
Pages
24

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Publication date
2024-07
Original language
German
Pages
24

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Overview

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress. There are no restrictions on the scope of application of this document. The application of this document increases investment security for manufacturers and users, provides test laboratories and manufacturers with defined specifications for testing, and ensures compatibility across manufacturers.

Cooperation at DIN

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