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Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023); German version EN IEC 63287-2:2023

Standard [CURRENT]

DIN EN IEC 63287-2:2024-10

Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023); German version EN IEC 63287-2:2023

German title
Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des Einsatzprofils (IEC 63287-2:2023); Deutsche Fassung EN IEC 63287-2:2023
Publication date
2024-10
Original language
German
Pages
19

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Publication date
2024-10
Original language
German
Pages
19
DOI
https://dx.doi.org/10.31030/3560873

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Overview

This part of IEC 63287 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. When designing the reliability testing plan, the test plan changes significantly depending on how the environmental conditions of the LSI are assumed. In electronic device units for use in motor vehicles that are installed near the engine, the operating temperature gradually rises due to the heat generated by the engine, but drops again after the engine is turned off, meaning that the device unit is not always exposed to extreme temperature conditions. The totality of the changing ambient temperatures and their time ratio is referred to as the "mission profile". Since the mission profile depends on several factors, such as the operating mode of the LSI, the installation environment, heat generation by peripheral parts, and so on, it cannot be standardized without restriction. It is therefore important to coordinate the mission profile between the LSI supplier and the user and to define precise test conditions. This document is not intended for military- and space-related applications. Typical application examples in this document include reliability testing that takes the mission profile of peripheral devices for automotive engines into account and reliability testing that takes the mission profile for automotive cab peripheral devices into account.

ICS

31.080.01

DOI

https://dx.doi.org/10.31030/3560873

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