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Standard [CURRENT] Article is not orderable

EN 61190-1-2:2007-06

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2007)

German title
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage (IEC 61190-1-2:2007)
Publication date
2007-06
Original language
English
Publication date
2007-06
Original language
English

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