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IEC 60191-4 AMD 1:2018-03

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1

German title: Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente; Änderung 1
Publication date: 2018-03
Original language: English, French
Pages: 29

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