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IEC 60749-38:2008-02

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 38: Soft-Error-Prüfverfahren für Halbleiterbauelemente mit Speicher
Publication date: 2008-02
Original language: English, French
Pages: 26

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