Design Guide for the Packaging of High Speed Electronic Circuits

Standard [CURRENT]

IPC 2251:2003-12-08

Design Guide for the Packaging of High Speed Electronic Circuits

Publication date
2003-12-08
Original language
English
Pages
99

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Publication date
2003-12-08
Original language
English
Pages
99
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Short description

This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions. 99 pages. Released November 2003. Included in the IPC- C-105, IPC-C-106, & IPC-C-1000 collections.
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