Design Guide for High Density Interconnects & Microvias

Standard [CURRENT]

IPC 2315:2000-11-01

IPC/JPCA-2315:2000-11-01

Design Guide for High Density Interconnects & Microvias

Publication date
2000-11-01
Original language
English
Pages
33

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Publication date
2000-11-01
Original language
English
Pages
33
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Short description

Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and manufacturers one source for reliable design and manufacturability information for commonly produced HDI boards. 33 pages. Released June 2000.
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