Specification for High Density Interconnect (HDI) and Microvia Materials

Standard [CURRENT]

IPC 4104:1999-05-09

Specification for High Density Interconnect (HDI) and Microvia Materials

Publication date
1999-05-09
Original language
English
Pages
58

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Publication date
1999-05-09
Original language
English
Pages
58
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Short description

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999. Included in the IPC-C-107 and IPC-C-1000 Collections.
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