Cover and Bonding Material for Flexible Printed Circuitry

Standard [CURRENT]

IPC 4203C:2025-04-01

Cover and Bonding Material for Flexible Printed Circuitry

Publication date
2025-04-01
Original language
English
Pages
52

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Publication date
2025-04-01
Original language
English
Pages
52
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Short description

This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
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