Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Standard [CURRENT]

IPC J-STD-027:2003-02-20

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Publication date
2003-02-20
Original language
English
Pages
13

118.80 EUR VAT included

111.03 EUR VAT excluded

Format and language options

PDF download 1

  • 118.80 EUR

Monitor with the Standards Ticker

1

Document with DRM – more on DRM

Easily subscribe: Save time and money now!

You can also subscribe to this document - together with other important standards in your industry. This makes your work easier and pays for itself after a short time.

Sparschwein_data
Subscription advantages
Sparschwein Vorteil 1_data

Important standards for your industry, regularly updated

Sparschwein Vorteil 2_data

Much cheaper than buying individually

Sparschwein Vorteil 3_data

Useful functions: Filters, version comparison and more

Publication date
2003-02-20
Original language
English
Pages
13
Loading recommended items...

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Short description

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003. Included in the IPC-C-103, IPC-C-106 and the IPC-C-1000 Collections.
Loading recommended items...