Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

Standard [CURRENT]

IPC JEDEC 9301:2018-12

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

Publication date
2018-12
Original language
English
Pages
92

201.20 EUR VAT included

188.04 EUR VAT excluded

Format and language options

PDF download 1

  • 201.20 EUR

Monitor with the Standards Ticker

1

Document with DRM – more on DRM

Easily subscribe: Save time and money now!

You can also subscribe to this document - together with other important standards in your industry. This makes your work easier and pays for itself after a short time.

Sparschwein_data
Subscription advantages
Sparschwein Vorteil 1_data

Important standards for your industry, regularly updated

Sparschwein Vorteil 2_data

Much cheaper than buying individually

Sparschwein Vorteil 3_data

Useful functions: Filters, version comparison and more

Publication date
2018-12
Original language
English
Pages
92
Loading recommended items...

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Short description

The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.
Loading recommended items...