Spherical Bend Test Method for Characterization of Board Level Interconnects

Standard [CURRENT]

IPC JEDEC 9707:2011-09-13

Spherical Bend Test Method for Characterization of Board Level Interconnects

Publication date
2011-09-13
Original language
English
Pages
15

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Publication date
2011-09-13
Original language
English
Pages
15
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Short description

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC. 15 pages. Released 2011. Included in the C-103 and C-1000 Collections.
Replacement amendments

This document has been modified by: IPC JEDEC 9707 AMD 1:2018-05-01

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