Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly

Standard [CURRENT]

IPC JEDEC J-STD-609C:2023-12-01

Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly

Publication date
2023-12-01
Original language
English
Pages
24

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Publication date
2023-12-01
Original language
English
Pages
24
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Short description

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: 1. those assemblies that are assembled with lead-containing or lead-free solder; 2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3. the maximum component temperature not to be exceeded during assembly or rework processing; 4. the base materials used in the PCB construction, including those PCBs that use halogen-free resin; 5. the surface finish of PCBs; and the conformal coating on PCBAs.
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