Time, Temperature and Humidity Stress of Final Board Finish Solderability; no Hard Copy

Standard [CURRENT]

IPC TR-585:2006-06-22

Time, Temperature and Humidity Stress of Final Board Finish Solderability; no Hard Copy

Publication date
2006-06-22
Original language
English
Pages
54

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Publication date
2006-06-22
Original language
English
Pages
54
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Short description

This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to solderability performance. The Sequential Electrochemical Reduduction Analysis (SERA) was used extensively to evaluate the solderability performance of the finishes after stress exposure. 54 pages. Released May 2006.
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