Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Standard [CURRENT]

NF C20-783:2025-07-25

NF EN IEC 60068-2-83:2025-07-25

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

German title
Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung tf: Prüfung der Lötbarkeit von elektronischen Bauelementen für oberflächenmontierbaren Bauelementen (SMD) nach dem Benetzungsbilanzverfahren unter Verwendung von Lotpaste
Publication date
2025-07-25
Original language
French
Pages
42

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Publication date
2025-07-25
Original language
French
Pages
42

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