Polyimide Printed Circuit Boards Fabrication of

Standard [CURRENT]

SAE ARP 1612A:2022-06-05

Polyimide Printed Circuit Boards Fabrication of

Publication date
2022-06-05
Original language
English
Pages
18

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Publication date
2022-06-05
Original language
English
Pages
18
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Short description

This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
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