Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications
Publication date
2020-01-14
Original language
English
Pages
19
Publication date
2020-01-14
Original language
English
Pages
19
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Short description
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments.