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IPC Standards

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  • Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    Standard [CURRENT] 2022-02-01

    IPC 6018D:2022-02-01

    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    This document has been modified by: IPC 6018DS:2022-08-01

    211.90 EUR VAT included

    198.04 EUR VAT excluded

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  • Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    Standard [CURRENT] 2022-08-01

    IPC 6018DS:2022-08-01

    Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    63.10 EUR VAT included

    58.97 EUR VAT excluded

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  • Qualification and Performance Specification for Printed Electronics on Flexible Substrates

    Standard [CURRENT] 2021-02-01

    IPC 6902:2021-02-01

    Qualification and Performance Specification for Printed Electronics on Flexible Substrates

    170.10 EUR VAT included

    158.97 EUR VAT excluded

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  • Qualification and Performance Specification for Printed Electronics on Rigid Substrates

    Standard [CURRENT] 2024-06-01

    IPC 6904:2024-06-01

    Qualification and Performance Specification for Printed Electronics on Rigid Substrates

    120.90 EUR VAT included

    112.99 EUR VAT excluded

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  • Requirement and Acceptance for Organic IC Substrates

    Standard [NEW] 2025-12-01

    IPC 6921:2025-12-01

    Requirement and Acceptance for Organic IC Substrates

    251.50 EUR VAT included

    235.05 EUR VAT excluded

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  • Design and Assembly Process Implementation of 3D Components

    Standard [CURRENT] 2023-01-01

    IPC 7091A:2023-01-01

    Design and Assembly Process Implementation of 3D Components

    211.90 EUR VAT included

    198.04 EUR VAT excluded

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  • Design and Assembly Process Implementation for Embedded Circuitry

    Standard [CURRENT] 2022-10-01

    IPC 7092A:2022-10-01

    Design and Assembly Process Implementation for Embedded Circuitry

    211.90 EUR VAT included

    198.04 EUR VAT excluded

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  • Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

    Standard [CURRENT] 2020-10-01

    IPC 7093A:2020-10-01

    Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

    211.90 EUR VAT included

    198.04 EUR VAT excluded

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  • Design and Assembly Process Implementation for Flip Chip and Die-Size Components

    Standard [CURRENT] 2018-01-01

    IPC 7094A:2018-01-01

    Design and Assembly Process Implementation for Flip Chip and Die-Size Components

    211.90 EUR VAT included

    198.04 EUR VAT excluded

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  • Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)

    Standard [CURRENT] 2024-08-01

    IPC 7095E:2024-08-01

    Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)

    211.90 EUR VAT included

    198.04 EUR VAT excluded

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