IPC Standards

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  • An In-Depth Look At Ionic Cleanliness Testing

    Standard [CURRENT] 2002-07-01

    IPC TR-583:2002-07-01

    An In-Depth Look At Ionic Cleanliness Testing

    This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion ...

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  • Performance Standard for Ball Grid Array Balls

    Standard [CURRENT] 2002-06-30

    IPC EIA J-STD-032:2002-06-30

    Performance Standard for Ball Grid Array Balls

    This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array ...

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  • Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer XML Schema Methodology

    Standard [CURRENT] 2002-02-28

    IPC 2511B:2002-02-28

    Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer XML Schema Methodology

    ANSI Approved. IPC-2511B specifies the XML schema that represents the data file format used to describe printed board and printed board assembly products with details sufficient for tooling ...

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  • Sectional Requirements for Shop Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework

    Standard [CURRENT] 2002-01-29

    IPC 2547:2002-01-29

    Sectional Requirements for Shop Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework

    ANSI Approved. This document describes event message content and an XML encoding scheme, that enables a detailed definition of messages in the domain of electronics inspection, test and ...

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  • Generic Requirements for Electronic Manufacturing Supply Chain Communication - Product Data eXchange (PDX)

    Standard [CURRENT] 2001-11-01

    IPC 2571:2001-11-01

    Generic Requirements for Electronic Manufacturing Supply Chain Communication - Product Data eXchange (PDX)

    ANSI Approved. This standard defines an XML encoding schema that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The schema is ...

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  • Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)

    Standard [CURRENT] 2001-11-01

    IPC 2576:2001-11-01

    Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)

    ANSI Approved. This standard covers the sectional requirements for product genealogy, or as-built manufacturing information. The standard facilitates the exchange of manufacturing information ...

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  • Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange

    Standard [CURRENT] 2001-11-01

    IPC 2578:2001-11-01

    Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange

    ANSI Approved. This standard covers the sectional requirements for the exchange of Bills of Material (BOM), Approved Manufacturer Lists (AML), Approved Supplier Lists (ASL), as well as the ...

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  • Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)

    Standard [CURRENT] 2001-10-01

    IPC 2541:2001-10-01

    Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)

    ANSI Approved. This standard defines an XML encoding schema to facilitate plug-and-play characteristics in a factory's shop-floor information system. This standard describes the generic event ...

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  • Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

    Standard [CURRENT] 2001-07-17

    IPC TR-486:2001-07-17

    Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

    This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in ...

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  • Design Guide for High Density Interconnects & Microvias

    Standard [CURRENT] 2000-11-01

    IPC 2315:2000-11-01; IPC/JPCA-2315:2000-11-01

    Design Guide for High Density Interconnects & Microvias

    Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various ...

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