IPC Standards

296 search results

  • General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

    Standard [CURRENT] 1994-04-01

    IPC DR-570A:1994-04-01

    General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

    Establishes nomenclature and requirements for solid carbide twist drills with four-faceted drill points used in the fabrication of printed boards. 9 pages. Revised April 1994. Included in the ...

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  • Composite Metallic Materials Specification for Printed Wiring Boards

    Standard [CURRENT] 1994-01-01

    IPC CF-152B:1994-01-01

    Composite Metallic Materials Specification for Printed Wiring Boards

    Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets ...

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  • SMT Process Guideline & Checklist

    Standard [CURRENT] 1993-07-01

    IPC S-816:1993-07-01

    SMT Process Guideline & Checklist

    This guide lists all types of processing problems and solutions for surface mount assembly. Covers bridging, skips, misalignment, placement and more. 38 pages. Released July 1993. Included in the ...

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  • Printed Board Description in Digital Form

    Standard [CURRENT] 1992-07-01

    IPC D-350D:1992-07-01

    Printed Board Description in Digital Form

    This document bears two reference numbers, and may be obtained from IPC or the IEC. IPC-D-350D and IEC 1182-1 are identical in technical content. The IEC version of this document also contains a ...

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  • Design Standard for Thick Film Multilayer Hybrid Circuits

    Standard [CURRENT] 1989-12-01

    IPC D-859:1989-12-01

    Design Standard for Thick Film Multilayer Hybrid Circuits

    This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages. Released December 1989.

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  • Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

    Standard [CURRENT] 2007-06-30

    IPC 5702:2007-06-30

    Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

    Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the ...

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  • Setting Up Ion Chromatography Capability

    Standard [CURRENT] 2006-01-31

    IPC WP-008:2006-01-31

    Setting Up Ion Chromatography Capability

    Ion chromatography has been recognized as a method for which the data output is ion specific and very precise in the quantification of ionic residues. This paper is intended for those ...

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  • Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

    Standard [CURRENT] 2004-10-27

    IPC 9194:2004-10-27

    Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

    This guideline standard is intended to aid in interpretation of the requirements in IPC-9191, "General Guidelines for Implementation of Statistical process Control," specifically for printed board ...

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  • Generic Requirements for Surface Mount Design and Land Pattern Standard

    Standard [CURRENT] 2010-06-30

    IPC 7351B:2010-06-30

    Generic Requirements for Surface Mount Design and Land Pattern Standard

    IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document's ...

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  • Design Guideline for Printed Electronics

    Standard [CURRENT] 2013-07-30

    IPC 2291:2013-07-30

    Design Guideline for Printed Electronics

    This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design ...

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