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Standard [CURRENT] 2008-02-11
Resin Coated Copper Foil for Printed Boards Guideline
118.80 EUR VAT included
111.03 EUR VAT excluded
Standard [CURRENT] 2007-09-19
Surface Insulation Resistance Handbook
211.90 EUR VAT included
198.04 EUR VAT excluded
Standard [CURRENT] 2007-04-04
Design Guide for Embedded Passive Device Printed Boards
Drilling Guidelines for Printed Boards
Standard [CURRENT] 2007-01-02
In-Process DPMO and Estimated Yield for PCAs
Standard [CURRENT] 2006-07-20
Design Guide for Protection of Printed Board Via Structures
Standard [CURRENT] 2006-06-22
Time, Temperature and Humidity Stress of Final Board Finish Solderability; no Hard Copy
165.90 EUR VAT included
155.05 EUR VAT excluded
Standard [CURRENT] 2006-06-12
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
This document has been modified by: IPC 4821 AMD 1:2010-04
Standard [CURRENT] 2006-05-02
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
Standard [CURRENT] 2006-04-26
Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
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