IPC Standards

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  • Specification for Immersion Tin Plating for Printed Circuit Boards

    Standard [CURRENT] 2012-01-01

    IPC 4554:2012-01-01

    Specification for Immersion Tin Plating for Printed Circuit Boards

    IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that ...

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    This document has been modified by: IPC 4554 AMD 1:2012-01-09

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  • Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

    Standard [CURRENT] 2014-01-14

    IPC 9706:2014-01-14

    Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

    This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board assemblies during the mechanical shock or drop ...

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  • Cleanliness Guidelines for Printed Board Fabricators

    Standard [CURRENT] 2013-05-17

    IPC 5703:2013-05-17

    Cleanliness Guidelines for Printed Board Fabricators

    Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed boards; this has often been attributed to a lack of understanding of ...

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  • Materials and Substances Declaration for Aerospace and Defense and Other Industries

    Standard [CURRENT] 2020-05-01

    IPC 1754 AMD 2:2020-05-01

    Materials and Substances Declaration for Aerospace and Defense and Other Industries

    IPC-1754-Am2, establishes the requirements for the exchanging material and substance data for Products between suppliers and their customers and has been developed through the participation of ...

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  • Materials and Substances Declaration for Aerospace and Defense and Other Industries; with Amendment 1

    Standard [CURRENT] 2019-03-01

    IPC 1754 + AMD 1:2019-03-01

    Materials and Substances Declaration for Aerospace and Defense and Other Industries; with Amendment 1

    IPC-1754 WAM 1 Materials and Substances Declaration for Aerospace and Defense and Other Industries establishes the requirements for exchanging material and substance data for products between ...

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    This document has been modified by: IPC 1754 AMD 2:2020-05-01

    Product with additional digital content.
    Weitere elektronische Beilagen
    Additional digitale content will be provided based on format and purchase option. Please note any information in the document.

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  • Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

    Standard [CURRENT] 2022-04-01

    IPC 4555:2022-04-01

    Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

    The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits.

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  • Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

    Standard [CURRENT] 2022-04-01

    IPC A-640A:2022-04-01

    Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

    The IPC-A-640A standard provides acceptance requirements and technical insight that have been removed from acceptance standards for cable and wire harness assemblies incorporating optical fiber ...

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  • Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

    Standard [CURRENT] 2022-04-01

    IPC D-640A:2022-04-01

    Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

    This document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology.

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  • Requirements for Printed Electronics Functional Dielectric Materials

    Standard [CURRENT] 2022-08-01

    IPC 4592:2022-08-01

    Requirements for Printed Electronics Functional Dielectric Materials

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  • General Electronic Components Model Based Definition (MBD) Standard

    Standard [CURRENT] 2022-07-01

    IPC DAC-2552:2022-07-01

    General Electronic Components Model Based Definition (MBD) Standard

    The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital ...

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