IPC Standards

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  • Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

    Standard [CURRENT] 2017-09-01

    IPC 9505:2017-09-01

    Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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  • Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

    Standard [CURRENT] 2017-09-01

    IPC 2226A:2017-09-01

    Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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  • Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications; Amendment 1

    Standard [CURRENT] 2017-10-01

    IPC J-STD-006C AMD 1:2017-10-01

    Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications; Amendment 1

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  • Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

    Standard [CURRENT] 2014-01-14

    IPC 9706:2014-01-14

    Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

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  • Cleanliness Guidelines for Printed Board Fabricators

    Standard [CURRENT] 2013-05-17

    IPC 5703:2013-05-17

    Cleanliness Guidelines for Printed Board Fabricators

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  • High Temperature Printed Board Flatness Guideline

    Standard [CURRENT] 2013-07-10

    IPC 9641:2013-07-10

    High Temperature Printed Board Flatness Guideline

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  • Specification for Immersion Tin Plating for Printed Circuit Boards

    Standard [CURRENT] 2012-01-01

    IPC 4554:2012-01-01

    Specification for Immersion Tin Plating for Printed Circuit Boards

    This document has been modified by: IPC 4554 AMD 1:2012-01-09

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  • Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

    Standard [CURRENT] 2013-12-09

    IPC 9709:2013-12-09

    Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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  • Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

    Standard [CURRENT] 2013-10-04

    IPC A-630:2013-10-04

    Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

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  • Selection and Application of Board Level Underfill Materials

    Standard [CURRENT] 2014-03-24

    IPC J-STD-030A:2014-03-24

    Selection and Application of Board Level Underfill Materials

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