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Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English

Draft standard

DIN EN IEC 61188-6-3:2022-04 - Draft

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English

German title
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-3: Anschlussflächengestaltung - Beschreibung von Anschlussflächen für Komponenten der Steckmontage (THT) (IEC 91/1700/CD:2021); Text Deutsch und Englisch
Date of issue
2022-03-11
Publication date
2022-04
Original language
German, English
Pages
35

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Date of issue
2022-03-11
Publication date
2022-04
Original language
German, English
Pages
35
DOI
https://dx.doi.org/10.31030/3334173

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ICS

31.180, 31.190

DOI

https://dx.doi.org/10.31030/3334173

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