Draft standard [WITHDRAWN]

DIN EN IEC 61189-2-808:2022-03 - Draft

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

German title: Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode (IEC 91/1690/CD:2020); Text Deutsch und Englisch
Date of issue: 2022-02-18
Publication date: 2022-03
Original language: German, English
Pages: 29

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31.180

https://dx.doi.org/10.31030/3330624

Replacement amendments

This document has been replaced by: DIN EN IEC 61189-2-808:2025-08 .

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