Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024

Draft standard

DIN EN IEC 61189-3-302:2025-11 - Draft

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Erkennung von Beschichtungsfehlern in unbestückten Leiterplatten durch Computertomographie (CT) (IEC 91/1973/CDV:2024); Deutsche und Englische Fassung prEN IEC 61189-3-302:2024
Date of issue
2025-10-31
Publication date
2025-11
Original language
German, English
Pages
32

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Date of issue
2025-10-31
Publication date
2025-11
Original language
German, English
Pages
32
DOI
https://dx.doi.org/10.31030/3649945
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ICS

31.180

DOI

https://dx.doi.org/10.31030/3649945

Cooperation at DIN

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