Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device (IEC 47D/997/CDV) (english version)

Draft standard

OVE EN IEC 63378-6-1:2025-11-01 - Draft

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device (IEC 47D/997/CDV) (english version)

Publication date
2025-11-01
Original language
English
Pages
18

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Publication date
2025-11-01
Original language
English
Pages
18
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