Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2023); German version EN IEC 60749-5:2024

Standard [CURRENT]

DIN EN IEC 60749-5:2024-09

VDE 0884-749-5:2024-09

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2023); German version EN IEC 60749-5:2024

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 5: Lebensdauerprüfung bei konstanter Temperatur und Feuchte unter elektrischer Beanspruchung (IEC 60749-5:2023); Deutsche Fassung EN IEC 60749-5:2024
Publication date
2024-09
Original language
German
Pages
13

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Publication date
2024-09
Original language
German
Pages
13

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Overview

This part of IEC 60749 provides a life test method for assessing the reliability of non-hermetically sealed semiconductor devices under constant heat, humidity, and electrical stress. There are no known limitations to the scope of application. Conditions for temperature, humidity, and electrical stress are applied to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors passing through it.

Replacement amendments

This document replaces DIN EN 60749-5:2018-01 .

Cooperation at DIN

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