Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
German title
Mechanische Normung von Halbleiterbauelementen - Teil 4: Kodierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente; Änderung 1
Publication date
2001-11
Accessibility
Original language
English,
French
Pages
5
Publication date
2001-11
Original language
English,
French
Pages
5
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