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IEC 60749-14:2003-08

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)
Publication date: 2003-08
Original language: English, French
Pages: 36

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