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IEC 60749-19:2003-02

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit
Publication date: 2003-02
Original language: English, French
Pages: 20

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Replacement amendments

This document has been modified by: IEC 60749-19 AMD 1:2010-07

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