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IEC 61189-3:1997-04
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
- German title
- Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
- Publication date
- 1997-04
- Original language
- English, French
- Pages
- 105
- Publication date
- 1997-04
- Original language
- English, French
- Pages
- 105
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Replacement amendments
This document has been modified by: IEC 61189-3 AMD 1:1999-07,IEC 61189-3 AMD 1:2006-08
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