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IEC 62047-22:2014-06

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

German title: Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 22: Elektromechanisches Zug-Prüfverfahren für leitfähige Dünnschichten auf flexiblen Substraten
Publication date: 2014-06
Original language: English, French
Pages: 20

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