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Standard [CURRENT] 2000-11-01
Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description
This item will be ordered specially for you, therefore delivery may take 1 to 2 weeks.
Price on request
Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description
Standard [CURRENT] 2000-06-30
1730A - Laminator Qualification Profile
Free of charge
Standard [CURRENT] 2000-06-01
Strategic Raw Materials Supplier Qualification Profile
Standard [CURRENT] 2000-01-01
Flame Retardant Article Translation
Standard [CURRENT] 2011-07-25
Guidelines for Cleaning of Printed Boards and Assemblies
211.90 EUR VAT included
198.04 EUR VAT excluded
Standard [CURRENT] 2011-09-13
Spherical Bend Test Method for Characterization of Board Level Interconnects
This document has been modified by: IPC JEDEC 9707 AMD 1:2018-05-01
Standard [CURRENT] 2011-12-21
Surface Mount Placement Equipment Characterization
Standard [CURRENT] 1995-05
Documentation Requirements for Printed Boards
165.90 EUR VAT included
155.05 EUR VAT excluded
Standard [CURRENT] 2012-02-03
Printed Circuit Assembly Strain Gage Test Guideline
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