IPC Standards

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  • Trusted Electronic Designer, Fabricator and Assembler Requirements

    Standard [CURRENT] 2025-12-01

    IPC 1791E:2025-12-01

    Trusted Electronic Designer, Fabricator and Assembler Requirements

    This standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become ...

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  • Design and Assembly Process Guidance for Bottom Termination Components (BTCs)

    Standard [CURRENT] 2026-01-01

    IPC 7093B:2026-01-01

    Design and Assembly Process Guidance for Bottom Termination Components (BTCs)

    The IPC-7093B guideline provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093B provides guidelines on critical design ...

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  • Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

    Standard [CURRENT] 2026-03-01

    IPC 4204C:2026-03-01

    Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

    IPC-4204C establishes the classification system, qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed ...

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  • Classification of Passive and Solid State Devices for Assembly Processes

    Standard [CURRENT] 2026-02-01

    IPC EIA/JEDEC J-STD-075B:2026-02-01

    Classification of Passive and Solid State Devices for Assembly Processes

    EIA/IPC/JEDEC J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to ...

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  • Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

    Standard [CURRENT] 2013-10-04

    IPC A-630:2013-10-04

    Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

    This standard is the first of its kind for IPC; the first acceptability standard for electronic enclosures. It contains acceptability criteria that pertain to the "box build" of the assembly process.

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  • IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Boards and Assemblies

    Technical rule [CURRENT] 2022-10-01

    IPC WP/TR-584B:2022-10-01

    IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Boards and Assemblies

    This document summarizes the IPC position on the use of tetra-bromobisphenol-A (TBBPA), a halogenated flame retardant that is reacted into materials for the electronics industry.

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