Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (IEC 60749-22-1:2025); German version EN IEC 60749-22-1:2026

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DIN EN IEC 60749-22-1:2026-11 - Draft

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (IEC 60749-22-1:2025); German version EN IEC 60749-22-1:2026

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit - Drahtbond-Zugprüfverfahren (IEC 60749-22-1:2025); Deutsche Fassung EN IEC 60749-22-1:2026
Date of issue
2026-10-16
Publication date
2026-11
Accessibility
Original language
German
Pages
64

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Date of issue
2026-10-16
Publication date
2026-11
Original language
German
Pages
64
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