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Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2562/CDV:2019); German version prEN IEC 60749-30:2019

Draft standard [WITHDRAWN]

DIN EN IEC 60749-30:2019-09 - Draft

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2562/CDV:2019); German version prEN IEC 60749-30:2019

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen (IEC 47/2562/CDV:2019); Deutsche Fassung prEN IEC 60749-30:2019
Date of issue
2019-08-23
Publication date
2019-09
Original language
German
Pages
25

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Date of issue
2019-08-23
Publication date
2019-09
Original language
German
Pages
25
DOI
https://dx.doi.org/10.31030/3089824

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ICS

31.080.01

DOI

https://dx.doi.org/10.31030/3089824
Replacement amendments

This document has been replaced by: DIN EN IEC 60749-30:2023-02 .

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