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Standard [CURRENT]

DIN EN IEC 60749-30:2023-02

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen (IEC 60749-30:2020); Deutsche Fassung EN IEC 60749-30:2020
Publication date
2023-02
Original language
German
Pages
17

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Publication date
2023-02
Original language
German
Pages
17
DOI
https://dx.doi.org/10.31030/3386369

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/3386369
Replacement amendments

This document replaces DIN EN 60749-30:2011-12 .

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